Takayuki Ohba Laboratory, Laboratory for Future Interdisciplinary Research of Science and Technology, Tokyo Institute of Technology
Semiconductors for CPUs and memory, indispensable for personal computers and smartphones, have improved performance through device shrinkage. However, we are encountering the physical limits of shrinking using conventional technology. The three-dimensional large-scale integration (3D LSI) technology that we developed has special vertical interconnect technology and special ultra-thinning technology for semiconductor die stacks, and improves performance while making the stacks smaller and thinner. Using this technology, we will integrate multiple semiconductor functions into a one- stack module, and our goal is to surpass the limits of shrinking devices two-dimensionally. Further, we will apply matured know-how of the semiconductor manufacturing process to heterogeneous fields and endeavor to create new industries in microfluid device and agricultural engineering.
Research Unit Leader Takayuki Ohba
Takayuki Ohba Profile
2013 Tokyo Institute of Technology, Professor
2004 The University of Tokyo, Professor
1984 Fujitsu Limited
National Chiao Tung University (NCTU Taiwan)
Ph.D received from Tohoku University in 1995
Tokyo Tech WOW Alliance
3-micronmeter Ultra-Thinnig 300mm SDRAM
Published in Tokyo Tech News [Achieves stealth dicing without damaging the wafer]
Three-dimensional stacking technology was published on the cover and magazine of the bulletin "Applied Physics Vol. 89, No. 2 (2020)". [Magazine]
Published in Tokyo Tech News [Thermal resistance has been reduced to 1/3 with 3D DRAM of WOW technology]
The closed-type plant ecology measurement device "SRP-450" jointly developed by Ohba Laboratory, Asahi Kogyo Co., Ltd., and TAZMO CO.,LTD. was introduced on Nikkei Technology Online.
[Article] [SRP-450 Pamphlet ]
Published in Tokyo Tech News [300mmウエハーを厚さ4マイクロメートルに超薄化]
Three-dimensional integration technology
We will use the ultra-thinning technology and the vertical interconnect technology possessed by the WOW Alliance to integrate semiconductors three-dimensionally and create a next-generation semiconductor that is higher in performance and lower in power consumption. Furthermore, this work will accelerate the ultra-miniaturization of not only large-scale computing devices such as servers, but various devices equipped with semiconductors to 1/1000th of their current size.
By combining ultra-small cooling devices with three-dimensional stacked semiconductors, our work will allow for simplification of cooling technology and application to the miniaturization of IoT and mobile devices.
We are developing MEMS devices that replicate the vital reactions that take place inside an organism. Specifically, the goal is to apply the semiconductor manufacturing process to prototype a platelet-producing device mimicking the structure and functions of the capillaries inside the spinal cord. We aim to realize stability and improved speed of platelet production at low cost by using fluid mechanics analysis to optimize the structure of the micro-fluid system.
To reveal the conditions for a plant’s maximum output, we will make it possible to monitor “what a plant wants.” We will develop closed-system cultivation devices based on semiconductor manufacturing technology to control the growth environment and draw out plant responses at high reproducibility. We will also create multimodal sensing technologies to quantify the various responses.